Samsung introduced that it has began mass manufacturing of its Automotive UFS 3.1, which will likely be accessible to international automakers and half producers by the tip of this yr. This storage will are available in 128, 256 and 512GB capacities. The 256GB mannequin, for instance, will supply sequential learn speeds of as much as 2,000MB/s and sequential writes as much as 700MB/s.
Samsung says that this UFS 3.1 has the bottom power consumption within the business, drawing 33% much less energy than the earlier technology product.
In case you’re questioning what’s the distinction between UFS that goes into telephones and one which goes into vehicles, it’s the endurance of the factor. The Automotive UFS 3.1 has been licensed AEC-Q100 Grade2, which ensures steady efficiency in a large temperature vary from -40°C to 105°C (-40°F to 221°F). This may nicely outdoors the vary the place smartphone chips are anticipated to function.
This storage is optimized for In-Automobile Infotainment (IVI) and can pair with different Samsung elements like Auto LPDDR5X, Auto GDDR6 and the Exynos Auto V920. This chipset has been chosen because the IVI mind for Hyundai Group’s subsequent gen vehicles. Samsung is already supplying some chips to Tesla (14nm from its Texas foundry), however the two firms are negotiating a provide of 5nm chips for Full Self Driving too. You may comply with extra automotive information over on our sister web site ArenaEV.
Anyway, Samsung will even provide its automotive UFS 3.1 to be used in ADAS – Superior Driver Help Programs – and has already acquired an ASPICE Stage 2 certification from prospects and C&BIS.
“Samsung’s new UFS 3.1 resolution addresses a variety of buyer wants for optimized IVI techniques whereas pushing ahead with next-generation reminiscence traits that require larger ESG requirements. We purpose to develop our presence within the automotive semiconductor market, following the introduction of our UFS 3.1 resolution for superior driver help techniques (ADAS),” stated Hyunduk Cho, Vice President of Reminiscence Product Planning Group at Samsung Electronics.
