Apple’s 2026 iPhones will use TSMC’s next-generation 2-nanometer fabrication course of together with a brand new packaging technique that may combine 12GB of RAM, a good supply of correct predictions about Apple’s plans has claimed.
In a Weibo put up on Tuesday, Chinese language-language consumer “Telephone Chip Knowledgeable” stated Apple’s A20 chip in iPhone 18 fashions will change from the earlier InFo (Built-in Fan-Out) packaging to WMCM (Wafer-Degree Multi-Chip Module) packaging, whereas reminiscence will probably be upgraded to 12GB.
When it comes to the variations in packaging technique, InFo permits integration of parts, together with reminiscence, inside the package deal however focuses extra on single-die packaging the place reminiscence is usually connected to the principle SoC (equivalent to DRAM positioned on prime or close to the CPU and GPU cores). It is optimized for lowering the dimensions and enhancing the efficiency of particular person chips.
WMCM, alternatively, excels at integrating a number of chips inside the similar package deal (therefore the “Multi-Chip Module” half). This technique permits extra complicated programs, equivalent to CPUs, GPUs, DRAM, and different customized accelerators (e.g., AI/ML chips) to be tightly built-in in a single package deal. It gives better flexibility in arranging several types of chips, stacking them vertically or putting them facet by facet, whereas additionally optimizing communication between them.
As for reminiscence, all present iPhone 16 fashions function 8GB of RAM, which is taken into account to be the minimal requirement for Apple Intelligence. Apple analyst Ming-Chi Kuo has stated he expects subsequent 12 months’s iPhone 17 Professional to function 12GB of RAM, so it may very well be that Apple will make it a brand new normal throughout the succeeding iPhone 18 collection.
Having stated that, Kuo additionally believes that solely “Professional” fashions within the iPhone 18 collection are possible to make use of TSMC’s next-generation 2nm processor know-how due to value issues. In the meantime, it is not clear whether or not the fabrication tech and the reminiscence dimension are indelibly intertwined in Apple’s plans.
Nanometer Generations
Phrases like “3nm” and “2nm” describe generations of chip manufacturing know-how, every with its personal set of design guidelines and structure. As these numbers lower, they often point out smaller transistor sizes. Smaller transistors enable extra to be packed onto a single chip, sometimes leading to elevated processing pace and improved energy effectivity. This 12 months’s iPhone 16 collection is predicated on an A18 chip design constructed utilizing a second-generation “N3P” 3-nanometer course of.
TSMC plans to begin manufacturing 2nm chips in late 2025, and Apple is anticipated to be the primary firm to obtain chips constructed on the brand new course of. TSMC typically builds new fabs when it wants to extend manufacturing capability to deal with important orders for chips, and TSMC is increasing in a serious means for 2nm know-how.
The leaker “Telephone Chip Knowledgeable” has a observe report of correct predictions. They had been first to accurately reveal that the usual iPhone 14 fashions would proceed to make use of the A15 Bionic chip, whereas the extra superior A16 chip could be unique to the iPhone 14 Professional fashions. Extra not too long ago, they had been the primary supply of details about Apple creating its personal AI server processor utilizing TSMC’s 3nm course of, concentrating on mass manufacturing by the second half of 2025.
